|
|
PDF MCP16312 Data sheet ( Hoja de datos )
| Número de pieza | MCP16312 | |
| Descripción | Integrated Synchronous Switch Step-Down Regulator | |
| Fabricantes | Microchip | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MCP16312 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
|
No Preview Available !
MCP16311/2
30V Input, 1A Output, High-Efficiency,
Integrated Synchronous Switch Step-Down Regulator
Features
• Up to 95% Efficiency
• Input Voltage Range: 4.4V to 30V
• 1A Output Current Capability
• Output Voltage Range: 2.0V to 24V
• Qualification: AEC-Q100 Rev. G, Grade 1 (-40°C
to 125°C)
• Integrated N-Channel High-Side and Low-Side
Switches:
- 170 m, Low Side
- 300 m, High Side
• Stable Reference Voltage: 0.8V
• Automatic Pulse Frequency Modulation/Pulse-
Width Modulation (PFM/PWM) Operation
(MCP16311):
- PFM Operation Disabled (MCP16312)
- PWM Operation: 500 kHz
• Low Device Shutdown Current: 3 µA typical
• Low Device Quiescent Current:
- 44 µA (non-switching, PFM Mode)
• Internal Compensation
• Internal Soft-Start: 300 µs (EN low-to-high)
• Peak Current Mode Control
• Cycle-by-Cycle Peak Current Limit
• Undervoltage Lockout (UVLO):
- 4.1V typical to start
- 3.6V typical to stop
• Overtemperature Protection
• Thermal Shutdown:
- +150°C
- +25°C Hysteresis
Applications
• PIC®/dsPIC® Microcontroller Bias Supply
• 24V Industrial Input DC-DC Conversion
• General Purpose DC-DC Conversion
• Local Point of Load Regulation
• Automotive Battery Regulation
• Set-Top Boxes
• Cable Modems
• Wall Transformer Regulation
• Laptop Computers
• Networking Systems
• AC-DC Digital Control Bias
• Distributed Power Supplies
General Description
The MCP16311/2 is a compact, high-efficiency, fixed
frequency, synchronous step-down DC-DC converter in
an 8-pin MSOP, or 2 x 3 TDFN package that operates
from input voltage sources up to 30V. Integrated
features include a high-side and a low-side switch, fixed
frequency peak current mode control, internal
compensation, peak current limit and overtemperature
protection. The MCP16311/2 provides all the active
functions for local DC-DC conversion, with fast transient
response and accurate regulation.
High converter efficiency is achieved by integrating the
current-limited, low-resistance, high-speed high-side
and low-side switches and associated drive circuitry.
The MCP16311 is capable of running in PWM/PFM
mode. It switches in PFM mode for light load
conditions and for large buck conversion ratios. This
results in a higher efficiency over all load ranges. The
MCP16312 runs in PWM-only mode, and is
recommended for noise-sensitive applications.
The MCP16311/2 can supply up to 1A of continuous
current while regulating the output voltage from 2V to
12V. An integrated, high-performance peak current
mode architecture keeps the output voltage tightly
regulated, even during input voltage steps and output
current transient conditions common in power systems.
The EN input is used to turn the device on and off.
While off, only a few micro amps of current are
consumed from the input.
Output voltage is set with an external resistor divider.
The MCP16311/2 is offered in small MSOP-8 and 2 x 3
TDFN surface mount packages.
Package Type
MCP16311/2
MSOP
MCP16311/2
2x3 TDFN*
VFB 1
VCC 2
EN 3
VIN 4
8 AGND VFB 1
8 AGND
7 BOOST VCC 2 EP 7 BOOST
6 SW
EN 3 9 6 SW
5 PGND VIN 4
5 PGND
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2013-2014 Microchip Technology Inc.
DS20005255B-page 1
1 page  
MCP16311/2
2.0 TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = EN = 7V, COUT = CIN = 2 x 10 µF, L = 22 µH, VOUT = 5.0V, ILOAD = 100 mA,
TA = +25°C, 8L-MSOP package.
100
90
80
70
60
50
40
30
20
10
0
1
VIN = 12V
FIGURE 2-1:
IOUT.
VIN = 6V
VIN = 24V
VIN = 30V
PWM/PFM
PWM ONLY
10 100
IOUT (mA)
1000
3.3V VOUT Efficiency vs.
100
80
60
IOUT = 200 mA
IOUT = 800 mA
IOUT = 10 mA
40
20
0
5 10
FIGURE 2-4:
PWM/PFM option
15 20 25 30
VIN (V)
3.3V VOUT Efficiency vs.VIN.
100
90
80
70
60
50
40
30
20
10
0
1
VIN = 12V
FIGURE 2-2:
IOUT.
VIN = 24V
VIN = 30V
PWM/PFM
PWM ONLY
10 100
IOUT (mA)
1000
5.0V VOUT Efficiency vs.
100
80
60
IOUT = 200 mA
IOUT = 800 mA
IOUT = 10 mA
40
20
0
6 10
FIGURE 2-5:
PWM/PFM option
14 18 22 26 30
VIN (V)
5.0V VOUT Efficiency vs.VIN.
100
90
80
70
60
50 VIN = 24V
40
30
20
10
0
1
FIGURE 2-3:
IOUT.
VIN = 15V
VIN = 30V
PWM/PFM
PWM ONLY
10 100
IOUT (mA)
1000
12.0V VOUT Efficiency vs.
100
80
IOUT = 800 mA
IOUT = 200 mA
60
IOUT = 10 mA
40
20
PWM/PFM option
0
12 14 16 18 20 22 24 26 28 30
VIN (V)
FIGURE 2-6:
VIN.
12.0V VOUT Efficiency vs.
2013-2014 Microchip Technology Inc.
DS20005255B-page 5
5 Page 
MCP16311/2
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
MCP16311/2
2 x 3 TDFN
1
MCP16311/2
MSOP
1
Symbol
VFB
2 2 VCC
3 3 EN
4 4 VIN
5 5 PGND
6 6 SW
7 7 BOOST
8 8 AGND
9 — EP
Description
Output Voltage Feedback pin. Connect VFB to an external resistor
divider to set the output voltage.
Internal Regulator Output pin. Bypass Capacitor is required on this
pin to provide high peak current for gate drive.
Enable pin. Logic high enables the operation. Do not allow this pin to
float.
Input Supply Voltage pin for power and internal biasing.
Power Ground pin
Output Switch Node pin, connects to the inductor and the bootstrap
capacitor.
Boost Voltage pin that supplies the driver used to control the high-
side NMOS switch. A bootstrap capacitor is connected between the
BOOST and SW pins.
Signal Ground pin
Exposed thermal pad
3.1 Feedback Voltage Pin (VFB)
The VFB pin is used to provide output voltage regulation
by using a resistor divider. The VFB voltage will be
0.800V typical with the output voltage in regulation.
3.2 Internal Bias Pin (VCC)
The VCC internal bias is derived from the input voltage
VIN. VCC is set to 5.0V typical. The VCC is used to pro-
vide a stable low bias voltage for the upper and lower
gate drive circuits. This output should be decoupled to
AGND with a 1 µF capacitor, X7R. This capacitor should
be connected as close as possible to the VCC and
AGND pin.
3.3 Enable Pin (EN)
The EN pin is a logic-level input used to enable or
disable the device and lower the quiescent current
while disabled. A logic high (> 1.3V) will enable the reg-
ulator output. A logic low (< 1V) will ensure that the reg-
ulator is disabled.
3.4 Power Supply Input Voltage Pin
(VIN)
Connect the input voltage source to VIN. The input
source should be decoupled to GND with a
4.7 µF-20 µF capacitor, depending on the impedance
of the source and output current. The input capacitor
provides current for the switch node and a stable volt-
age source for the internal device power. This capacitor
should be connected as close as possible to the VIN
and GND pins. For light-load applications, a 2.2 µF
X7R or X5R ceramic capacitor can be used.
3.5 Analog Ground Pin (AGND)
This ground is used by most internal circuits, such as
the analog reference, control loop and other circuits.
3.6 Power Ground Pin (PGND)
This is a separate ground connection used for the low-
side synchronous switch.The length of the trace from
the input cap return, output cap return and GND pin
should be made as short as possible to minimize the
noise in the system. The power ground and the analog
ground should be connected in a single point.
3.7 Switch Node Pin (SW)
The switch node pin is connected internally to the low-
side and high-side switch, and externally to the SW
node, consisting of the inductor and boost capacitor.
The SW node can rise very fast as a result of the
internal switch turning on.
3.8 Boost Pin (BOOST)
The high side of the floating supply used to turn the
integrated N-Channel high-side MOSFET on and off is
connected to the boost pin.
3.9 Exposed Thermal Pad Pin (EP)
There is an internal electrical connection between the
EP and the PGND and AGND pins.
2013-2014 Microchip Technology Inc.
DS20005255B-page 11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MCP16312.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MCP1631 | Pulse Width Modulator | Microchip |
| MCP16311 | Integrated Synchronous Switch Step-Down Regulator | Microchip |
| MCP16312 | Integrated Synchronous Switch Step-Down Regulator | Microchip |
| MCP1631HV | Pulse Width Modulator | Microchip |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |