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PDF NCS37012 Data sheet ( Hoja de datos )
| Número de pieza | NCS37012 | |
| Descripción | Self Test Ground Fault Circuit Interrupter | |
| Fabricantes | ON Semiconductor | |
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NCS37012
Self Test Ground Fault
Circuit Interrupter (GFCI)
Description
The NCS37012 is a fully UL943 compliant signal processor for
GFCI applications with self test. The device integrates a flexible
power supply (including both shunt and LDO regulators), differential
fault, and grounded-neutral detection circuits. Proprietary impedance
measurement and signal processing techniques are used to minimize
the number of external components and improve performance. The
device also includes a specialized DSP controller that offers best in
class immunity to nuisance loads without the need for external analog
filters. Self test is monitored every 17 minutes through an external
current path and internally generated grounded neutral fault.
Features
• 6.0 V − 12 V Operation (120 − 480 V AC mains with the appropriate
series impedance)
• −40 to 85°C
• Very Low Power Consumption: <15 mW @ 5 V
• 16 Pin QFN Package or 20 Pin TSSOP Package
• Single Current Transformer (CT) Detection of both Differential and
Grounded−Neutral Faults
• Full Self Test and Trip Indicator Monitoring
• Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to
Guarantee Full Resolution on 50 and 60 Hz Distribution Systems
• Optimized Solenoid Deployment (coil is not energized near the AC
mains zero crossings)
• Randomized Testing Sequence to Minimize Noise and Potential
Interactions on the AC Mains
• >5 mA SCR Driver for use with High Igt SCR’s for Improved Noise
Immunity
• Superior Immunity to Nuisance Loads/Noise (up to 10 A) without
Loss of Detection Capability or CT Saturation
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Load Panel GFCI Breakers
• GFCI Receptacles
• In−line GFCI Circuits (power cords)
www.onsemi.com
1
QFN16
MN SUFFIX
CASE 485G
20
TSSOP−20
DA SUFFIX
CASE 948E
1
MARKING DIAGRAMS
37012
MNG
ALYW
G
3701
2DBG
ALYWG
G
XXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
MLD
CTresGN
CTbias
CTstim
1
GND
(Top View)
ORDERING INFORMATION
Device
Package
Shipping†
NCS37012MNTWG QFN16 3000 / Tape &
(Pb−Free)
Reel
NCS37012DBRG TSSOP20 2500 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 0
1
Publication Order Number:
NCS37012/D
1 page  
NCS37012
APPLICATIONS INFORMATION
LINE
ResMLD
ResMAIN
CapSUP
Q1
CapSCR
MLD
CapBias
ResGN
CapGN
CapCT
CTresGN
CTbias
CTstim
ResLED
ResTI
TI
PTT
TE
PZ
LOAD
ResGFTST
Q2
ResD
CapIDF
Figure 2. Typical Application Schematic
www.onsemi.com
5
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet NCS37012.PDF ] | |
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