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PDF LT3216 Data sheet ( Hoja de datos )

Número de pieza LT3216
Descripción 1A Low Noise High Current LED Charge Pump
Fabricantes Linear Technology 
Logotipo Linear Technology Logotipo



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LTC3216
1A Low Noise High Current
LED Charge Pump with
Independent Torch/Flash Current Control
FEATURES
s High Efficiency Operation: 1x, 1.5x or 2x Boost
Modes with Automatic Mode Switching
s Ultralow Dropout ILED Current Control
s Output Current up to 1A
s Low Noise Constant Frequency Operation*
s Independent Low Current/High Current
Programming and Enable Pins
s Wide VIN Range: 2.9V to 4.4V
s Open/Shorted LED Protection
s LED Disconnect in Shutdown
s Low Shutdown Current: 2.5µA
s 4% LED Current Programming Accuracy
s Automatic Soft-Start Limits Inrush Current
s No Inductors
s Tiny Application Circuit (All Components <1mm
Profile)
s 3mm × 4mm 12-ULead DFN Package
APPLICATIO S
s LED Torch/Camera Light Supply for Cell Phones,
PDAs and Digital Cameras
s Generic Lighting and/or Flash/Strobe Applications
DESCRIPTIO
The LTC®3216 is a low noise, high current charge pump
DC/DC converter designed to power high current LEDs.
The part includes an accurate programmable current
source capable of driving loads up to 1A from a 2.9V to
4.4V input. Low external parts count (two flying capaci-
tors, two programming resistors and two bypass capaci-
tors at VIN and CPO) make the LTC3216 ideally suited for
small, battery-powered applications.
Built-in soft-start circuitry prevents excessive inrush cur-
rent during start-up. High switching frequency enables the
use of small external capacitors. Independent high and
low current settings are programmed by two external
resistors. Shutdown mode and current output levels are
selected via two logic inputs.
An ultralow dropout current source maintains accurate
LED current at very low ILED voltages. Automatic mode
switching optimizes efficiency by monitoring the voltage
across the LED current source and switching modes only
when ILED dropout is detected. The LTC3216 is available in
a small 3mm × 4mm 12-Lead DFN package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
*Protected by U.S. Patents including 6411531.
TYPICAL APPLICATIO
C1
2.2µF
C2
2.2µF
2.9V TO 4.4V
CIN
2.2µF
EN1 (TORCH)
EN2 (FLASH)
C1+ C1C2+ C2
VIN CPO
LTC3216
LED1
CCPO
4.7µF
ILED
EN1
EN2
ISET1 ISET2
20k 6.65k
1% 1%
EN1 EN2
00
10
01
11
LED1: LUMILEDS LXCL-PWF1 LUXEON FLASH
ILED
0 (SHUTDOWN)
200mA (TORCH)
600mA
800mA (FLASH)
3216 TA01a
Torch Mode Efficiency vs VIN
100
90 ILED = 200mA
80
70
60
50
40
30
20 PLED/PIN
10 LUMILEDS LXCL-PWF1
VF = 3V TYP AT 200mA
0
2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4
VIN (V)
3216 TA01b
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LT3216 pdf
LTC3216
PI FU CTIO S
C2+, C1+, C2, C1(Pins 1, 2, 10, 12): Charge Pump
Flying Capacitor Pins. A 2.2µF X5R or X7R ceramic
capacitor should be connected from C1+ to C1and from
C2+ to C2.
CPO (Pin 3): Output. CPO is the output of the Charge
Pump. This pin may be enabled or disabled using the EN1
and EN2 inputs. A 4.7µF X5R or X7R ceramic capacitor is
required from CPO to GND.
ISET1/ISET2 (Pins 4, 6): LED Current Programming Resis-
tor Pins. The ISET1 and ISET2 pins will servo to 1.22V.
Resistors connected between each of these pins and GND
are used to set the high and low LED current levels.
Connecting a resistor of 2kor less will cause the
LTC3216 to enter overcurrent shutdown mode.
ILED (Pin 5): Output. ILED is the LED current source output.
The LED is connected between CPO (anode) and ILED
(cathode). The current into the ILED pin is set via the EN1
and EN2 inputs, and the programming resistors con-
nected from ISET2 and ISET1 to GND.
EN1/EN2 (Pins 7, 8): Inputs. The EN1 and EN2 pins are
used to select which current level is being supplied to the
LED, as well as to put the part into shutdown mode. The
truth table for these pins is as follows:
Truth Table
EN1
0
1
0
1
EN2
0
0
1
1
MODE
Shutdown
Low Current
High Current
Low + High Current
VIN (Pin 9): Power. Supply voltage for the LTC3216. VIN
should be bypassed with a 2.2µF or greater low impedance
ceramic capacitor to GND.
GND (Pin 11): Charge Pump Ground. This pin should be
connected directly to a low impedance ground plane.
EXPOSED PAD (Pin 13): Control Signal Ground. This pad
must be soldered to a low impedance ground plane for
optimum thermal and electrical performance.
BLOCK DIAGRA
C1+ C1C2+ C2
2 12 1 10
OSCILLATOR
VIN 9
EN2 8
EN1 7
CONTROL
LOGIC
11
GND
1X MODE: CPO = VIN
1.5X MODE: CPO = 4.6V
2X MODE: CPO = 5.1V
+ VREF
MODE
CONTROL
DROPOUT
DETECTOR
3 CPO
5 ILED
CURRENT
SOURCE
CONTROL
64
ISET2 ISET1
13
GND
3216 BD
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LT3216 arduino
PACKAGE DESCRIPTIO
DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
LTC3216
0.65 ±0.05
3.50 ±0.05
1.70 ±0.05
2.20 ±0.05 (2 SIDES)
PACKAGE OUTLINE
0.25 ± 0.05
0.50
BSC
3.30 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(2 SIDES)
R = 0.20
TYP
R = 0.115
7 TYP
0.38 ± 0.10
12
PIN 1
TOP MARK
(NOTE 6)
3.00 ±0.10 1.70 ± 0.10
(2 SIDES) (2 SIDES)
0.200 REF
0.75 ±0.05
0.00 – 0.05
61
0.25 ± 0.05
0.50
BSC
3.30 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
NOTCH
(UE12/DE12) DFN 0603
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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