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PDF LT3013B Data sheet ( Hoja de datos )
| Número de pieza | LT3013B | |
| Descripción | 4V to 80V Low Dropout Micropower Linear Regulator | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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LT3013B
250mA, 4V to 80V
Low Dropout Micropower
Linear Regulator with PWRGD
FEATURES
■ Wide Input Voltage Range: 4V to 80V
■ Low Quiescent Current: 65µA
■ Low Dropout Voltage: 400mV
■ Output Current: 250mA
■ No Protection Diodes Needed
■ Adjustable Output from 1.24V to 60V
■ Stable with 3.3µF Output Capacitor
■ Stable with Aluminum, Tantalum or Ceramic
Capacitors
■ Reverse-Battery Protection
■ No Reverse Current Flow from Output to Input
■ Thermal Limiting
■ Thermally Enhanced 16-Lead TSSOP and 12 Pin
(4mm × 3mm) DFN Package
U
APPLICATIO S
■ Low Current High Voltage Regulators
■ Regulator for Battery-Powered Systems
■ Telecom Applications
■ Automotive Applications
DESCRIPTIO
The LT®3013B is a high voltage, micropower low dropout
linear regulator. The device is capable of supplying 250mA
of output current with a dropout voltage of 400mV. De-
signed for use in battery-powered or high voltage sys-
tems, the low quiescent current (65µA operating) makes
the LT3013B an ideal choice. Quiescent current is also well
controlled in dropout.
Other features of the LT3013B include a PWRGD flag to
indicate output regulation. The delay between regulated
output level and flag indication is programmable with a
single capacitor. The LT3013B also has the ability to
operate with very small output capacitors. The regulator is
stable with only 3.3µF on the output while most older
devices require between 10µF and 100µF for stability.
Small ceramic capacitors can be used without any need for
series resistance (ESR) as is common with other regula-
tors. Internal protection circuitry includes reverse-battery
protection, current limiting, thermal limiting and reverse
current protection.
The device is available with an adjustable output with a
1.24V reference voltage. The LT3013B regulator is avail-
able in the thermally enhanced 16-lead TSSOP and the low
profile (0.75mm), 12 pin (4mm × 3mm) DFN package,
both providing excellent thermal characteristics.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATIO
VIN
5.4V TO
80V
5V Supply
IN OUT
LT3013B
1µF 1.6M
ADJ
PWRGD
GND CT
750k
249k
VOUT
5V
250mA
3.3µF
1000pF
3013 TA01
400
350
300
250
200
150
100
50
0
0
Dropout Voltage
50 100 150 200
OUTPUT CURRENT (mA)
250
3013 TA02
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TYPICAL PERFOR A CE CHARACTERISTICS
ADJ Pin Bias Current
50
45
40
35
30
25
20
15
10
5
0
– 50 – 25
0 25 50 75
TEMPERATURE (°C)
100 125
3013 G13
CT Charging Current
4.0 PWRGD TRIPPED HIGH
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
– 50 – 25
0 25 50 75
TEMPERATURE (°C)
100 125
3013 G27
Current Limit
0.7
0.6
0.5
0.4
0.3
0.2
0.1 VIN = 7V
0 VOUT = 0V
–50 –25 0
25 50
75
TEMPERATURE (°C)
100 125
3013 G15
PWRGD Trip Point
95
94
93
92
91
OUTPUT RISING
90
89
88 OUTPUT FALLING
87
86
85
– 50 – 25
0 25 50 75 100 125
TEMPERATURE (°C)
3013 G25
CT Comparator Thresholds
2.0
1.8 VCT (HIGH)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2 VCT (LOW)
0
– 50 – 25
0 25 50 75 100 125
TEMPERATURE (°C)
3013 G28
Reverse Output Current
200
TJ = 25°C
180 VIN = 0V
160 VOUT = VADJ
140
120
100 CURRENT FLOWS
INTO OUTPUT PIN
80
60
ADJ
PIN CLAMP
(SEE APPLICATIONS
INFORMATION)
40
20
0
0 1 2 3 4 5 6 7 8 9 10
OUTPUT VOLTAGE (V)
3013 G16
LT3013B
PWRGD Output Low Voltage
200 IPWRGD = 50µA
180
160
140
120
100
80
60
40
20
0
– 50 – 25
0 25 50 75 100 125
TEMPERATURE (°C)
3013 G26
Current Limit
1.0
VOUT = 0V
0.9
0.8
0.7 TJ = 25°C
0.6
TJ = 125°C
0.5
0.4
0.3
0.2
0.1
0
0 10 20 30 40 50 60
INPUT VOLTAGE (V)
70 80
3013 G14
Reverse Output Current
35
VIN = 0V
30 VOUT = VADJ = 1.24V
25
20
15
10
5
0
– 50 – 25
0 25 50 75
TEMPERATURE (°C)
100 125
3013 G17
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LT3013B
APPLICATIO S I FOR ATIO
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. Measured Thermal Resistance (TSSOP)
COPPER AREA
TOPSIDE BACKSIDE BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq mm 2500 sq mm
40°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm 2500 sq mm 2500 sq mm
50°C/W
100 sq mm 2500 sq mm 2500 sq mm
62°C/W
Table 2. Measured Thermal Resistance (DFN)
COPPER AREA
TOPSIDE BACKSIDE BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq mm 2500 sq mm
40°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm 2500 sq mm 2500 sq mm
50°C/W
100 sq mm 2500 sq mm 2500 sq mm
62°C/W
The thermal resistance junction-to-case (θJC), measured
at the exposed pad on the back of the die, is 16°C/W.
Continuous operation at large input/output voltage differ-
entials and maximum load current is not practical due to
thermal limitations. Transient operation at high input/
output differentials is possible. The approximate thermal
time constant for a 2500sq mm 3/32" FR-4 board with
maximum topside and backside area for one ounce copper
is 3 seconds. This time constant will increase as more
thermal mass is added (i.e. vias, larger board, and other
components).
For an application with transient high power peaks, aver-
age power dissipation can be used for junction tempera-
ture calculations as long as the pulse period is significantly
less than the thermal time constant of the device and
board.
Calculating Junction Temperature
Example 1: Given an output voltage of 5V, an input voltage
range of 8V to 12V, an output current range of 0mA to
250mA, and a maximum ambient temperature of 30°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
IOUT(MAX) • (VIN(MAX) – VOUT) + (IGND • VIN(MAX))
where:
IOUT(MAX) = 250mA
VIN(MAX) = 12V
IGND at (IOUT = 250mA, VIN = 12V) = 8mA
So:
P = 250mA • (12V – 5V) + (8mA • 12V) = 1.85W
The thermal resistance will be in the range of 40°C/W to
62°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
1.85W • 50°C/W = 92.3°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
TJMAX = 30°C + 92.3°C = 122.3°C
Example 2: Given an output voltage of 5V, an input voltage
of 48V that rises to 72V for 5ms(max) out of every 100ms,
and a 5mA load that steps to 200mA for 50ms out of every
250ms, what is the junction temperature rise above ambi-
ent? Using a 500ms period (well under the time constant
of the board), power dissipation is as follows:
P1(48V in, 5mA load) = 5mA • (48V – 5V)
+ (200µA • 48V) = 0.23W
P2(48V in, 50mA load) = 200mA • (48V – 5V)
+ (8mA • 48V) = 8.98W
P3(72V in, 5mA load) = 5mA • (72V – 5V)
+ (200µA • 72V) = 0.35W
P4(72V in, 50mA load) = 200mA • (72V – 5V)
+ (8mA • 72V) = 13.98W
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| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet LT3013B.PDF ] | |
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