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STM32F302ZD 데이터시트 PDF




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부품번호 STM32F302ZD 기능
기능 ARM Cortex-M4 32b MCU+FPU
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STM32F302ZD 데이터시트, 핀배열, 회로
STM32F302xD STM32F302xE
ARM® Cortex®-M4 32b MCU+FPU, up to 512KB Flash, 64KB
SRAM, FMC, 2 ADCs, 1 DAC ch., 4 comp, 2 Op-Amp, 2.0-3.6 V
Datasheet - production data
Features
Core: ARM® Cortex®-M4 32-bit CPU with
72 MHz FPU, single-cycle multiplication and
HW division, DSP instruction and MPU
(memory protection unit)
Operating conditions:
– VDD, VDDA voltage range: 2.0 V to 3.6 V
Memories
– Up to 512 Kbytes of Flash memory
– 64 Kbytes of SRAM, with HW parity check
implemented on the first 32 Kbytes.
– Flexible memory controller (FMC) for static
memories, with four Chip Select
CRC calculation unit
Reset and supply management
– Power-on/Power-down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low power modes: Sleep, Stop and Standby
– VBAT supply for RTC and backup registers
Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x 16 PLL option
Internal 40 kHz oscillator
Up to 115 fast I/Os
– All mappable on external interrupt vectors
– Several 5 V-tolerant
Interconnect matrix
12-channel DMA controller
Two ADCs 0.20 µs (up to 18 channels) with
selectable resolution of 12/10/8/6 bits, 0 to
3.6 V conversion range, separate analog
supply from 2.0 to 3.6 V
One 12-bit DAC channels with analog supply
from 2.4 to 3.6 V
Four ultra-fast rail-to-rail analog comparators
with analog supply from 2.0 to 3.6 V
Two operational amplifiers that can be used in
PGA mode, all terminals accessible with analog
supply from 2.4 to 3.6 V
Up to 24 capacitive sensing channels supporting
touchkey, linear and rotary touch sensors
)%*$
LQFP64
(10 × 10 mm)
LQFP100
(14 × 14 mm)
LQFP144
(20 x 20 mm)
UFBGA100
(7 x 7 mm)
Up to 11 timers
– One 32-bit timer and two 16-bit timers with
up to four IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input
– One 16-bit 6-channel advanced-control
timers, with up to six PWM channels,
deadtime generation and emergency stop
– One 16-bit timer with two IC/OCs, one
OCN/PWM, deadtime generation and
emergency stop
– Two 16-bit timers with IC/OC/OCN/PWM,
deadtime generation and emergency stop
– Two watchdog timers (independent, window)
– One SysTick timer: 24-bit downcounter
– One 16-bit basic timers to drive the DAC
Calendar RTC with Alarm, periodic wakeup
from Stop/Standby
Communication interfaces
– CAN interface (2.0B Active)
– Three I2C Fast mode plus (1 Mbit/s) with
20 mA current sink, SMBus/PMBus, wakeup
from STOP
– Up to five USART/UARTs (ISO 7816
interface, LIN, IrDA, modem control)
– Up to four SPIs, 4 to 16 programmable bit
frames, two with multiplexed half/full duplex
I2S interface
– USB 2.0 full speed interface with LPM
support
Infrared transmitter
SWD, Cortex®-M4 with FPU ETM, JTAG
96-bit unique ID
Reference
STM32F302xD
STM32F302xE
Table 1. Device summary
Part number
STM32F302RD, STM32F302VD, STM32F302ZD.
STM32F302RE, STM32F302VE, STM32F302ZE.
April 2015
This is information on a product in full production.
DocID026900 Rev 2
1/175
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STM32F302ZD pdf, 반도체, 판매, 대치품
Contents
STM32F302xD STM32F302xE
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
6.3.8
6.3.9
6.3.10
6.3.11
6.3.12
6.3.13
6.3.14
6.3.15
6.3.16
6.3.17
6.3.18
6.3.19
6.3.20
6.3.21
6.3.22
6.3.23
6.3.24
Embedded reset and power control block characteristics . . . . . . . . . . . 69
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 153
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
7.1 LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
7.2 UFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
7.3 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
7.4 LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
7.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
7.5.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
7.5.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 170
8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
4/175
DocID026900 Rev 2

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STM32F302ZD 전자부품, 판매, 대치품
STM32F302xD STM32F302xE
List of tables
Table 96.
Table 97.
Table 98.
Table 99.
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
DocID026900 Rev 2
7/175
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관련 데이터시트

부품번호상세설명 및 기능제조사
STM32F302ZD

ARM Cortex-M4 32b MCU+FPU

STMicroelectronics
STMicroelectronics
STM32F302ZE

ARM Cortex-M4 32b MCU+FPU

STMicroelectronics
STMicroelectronics

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