Datasheet.kr   

SiHF820S 데이터시트 PDF




Vishay에서 제조한 전자 부품 SiHF820S은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 SiHF820S 자료 제공

부품번호 SiHF820S 기능
기능 Power MOSFET ( Transistor )
제조업체 Vishay
로고 Vishay 로고


SiHF820S 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




전체 8 페이지수

미리보기를 사용할 수 없습니다

SiHF820S 데이터시트, 핀배열, 회로
www.vishay.com
IRF820S, SiHF820S, IRF820L, SiHF820L
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) ()
Qg (Max.) (nC)
Qgs (nC)
Qgd (nC)
Configuration
500
VGS = 10 V
24
3.3
13
Single
I2PAK (TO-262)
D2PAK (TO-263)
3.0
D
G
DS
G
D
S
G
S
N-Channel MOSFET
FEATURES
• Surface mount
• Available in tape and reel
• Dynamic dV/dt rating
Available
• Repetitive avalanche rated
• Fast switching
Available
• Ease of paralleling
• Simple drive requirements
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Lead (Pb)-free
Note
a. See device orientation.
D2PAK (TO-263)
SiHF820S-GE3
IRF820SPbF
D2PAK (TO-263)
SiHF820STRL-GE3 a
IRF820STRLPbF a
D2PAK (TO-263)
SiHF820STRR-GE3 a
IRF820STRRPbF a
I2PAK (TO-262)
SiHF820L-GE3
IRF820LPbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current a
Linear Derating Factor
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Avalanche Current a
Repetitive Avalanche Energy a
Maximum Power Dissipation
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
VGS at 10 V
TC = 25 °C
TC = 100 °C
VDS
VGS
ID
IDM
TC = 25 °C
TA = 25 °C
EAS
IAR
EAR
PD
dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
for 10 s
TJ, Tstg
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 60 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).
c. ISD 2.5 A, dI/dt 50 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
LIMIT
500
± 20
2.5
1.6
8.0
0.40
0.025
210
2.5
5.0
50
3.1
3.5
-55 to +150
300
UNIT
V
A
W/°C
mJ
A
mJ
W
V/ns
°C
S15-1659-Rev. D, 20-Jul-15
1
Document Number: 91060
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000




SiHF820S pdf, 반도체, 판매, 대치품
www.vishay.com
IRF820S, SiHF820S, IRF820L, SiHF820L
Vishay Siliconix
100 150 °C
25 °C
VGS = 0 V
0.4 0.6 0.8 1.0 1.2
91060_07
VSD, Source-to-Drain Voltage (V)
Fig. 7 - Typical Source-Drain Diode Forward Voltage
102
5
2
10
5
2
1
5
2
0.1
5
2
10-2
0.1 2
Operation in this area limited
by RDS(on)
10 µs
100 µs
1 ms
10 ms
51 2
TC = 25 °C
TJ = 150 °C
Single Pulse
5 10 2 5 102 2
5 103 2
5 104
91060_08
VDS, Drain-to-Source Voltage (V)
Fig. 8 - Maximum Safe Operating Area
10
2.5
2.0
1.5
1.0
0.5
0.0
25
50 75 100 125 150
91060_09
TC, Case Temperature (°C)
Fig. 9 - Maximum Drain Current vs. Case Temperature
VDS
VGS
Rg
RD
D.U.T.
10 V
Pulse width 1 µs
Duty factor 0.1 %
+- VDD
Fig. 10a - Switching Time Test Circuit
VDS
90 %
10 %
VGS
td(on) tr
td(off) tf
Fig. 10b - Switching Time Waveforms
D = 0.5
1
0.2
0.1
0.05
0.1 0.02
0.01
10-2
10-5
Single Pulse
(Thermal Response)
10-4
10-3
10-2
PDM
t1
t2
Notes:
1. Duty Factor, D = t1/t2
2. Peak Tj = PDM x ZthJC + TC
0.1 1
10
91060_11
t1, Rectangular Pulse Duration (s)
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
S15-1659-Rev. D, 20-Jul-15
4
Document Number: 91060
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

4페이지










SiHF820S 전자부품, 판매, 대치품
Package Information
Vishay Siliconix
TO-263AB (HIGH VOLTAGE)
(Datum A)
4 L1
34
E
4
A
A
AB
c2
D5
H
CC
123
L2
BB
Detail A
2xe
2 x b2
2xb
0.010 M A M B
Plating
(c)
A
c
± 0.004 M B
5
b1, b3
Base
metal
c1 5
Gauge
plane
0° to 8°
H
B
Seating plane
L3 L L4
A1
Detail “A”
Rotated 90° CW
scale 8:1
E
D1 4
Lead tip
(b, b2)
Section B - B and C - C
Scale: none
E1
View A - A
4
MILLIMETERS
INCHES
MILLIMETERS
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
DIM.
MIN.
MAX.
MIN.
MAX.
A
4.06
4.83
0.160
0.190
D1 6.86
- 0.270 -
A1
0.00
0.25
0.000
0.010
E
9.65
10.67
0.380
0.420
b
0.51
0.99
0.020
0.039
E1 6.22
- 0.245 -
b1
0.51
0.89
0.020
0.035
e 2.54 BSC
0.100 BSC
b2
1.14
1.78
0.045
0.070
H
14.61
15.88
0.575
0.625
b3
1.14
1.73
0.045
0.068
L
1.78
2.79
0.070
0.110
c
0.38
0.74
0.015
0.029
L1 - 1.65 - 0.066
c1
0.38
0.58
0.015
0.023
L2 - 1.78 - 0.070
c2
1.14
1.65
0.045
0.065
L3 0.25 BSC
0.010 BSC
D
8.38
9.65
0.330
0.380
L4
4.78
5.28
0.188
0.208
ECN: S-82110-Rev. A, 15-Sep-08
DWG: 5970
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions are shown in millimeters (inches).
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the
outmost extremes of the plastic body at datum A.
4. Thermal PAD contour optional within dimension E, L1, D1 and E1.
5. Dimension b1 and c1 apply to base metal only.
6. Datum A and B to be determined at datum plane H.
7. Outline conforms to JEDEC outline to TO-263AB.
Document Number: 91364
Revision: 15-Sep-08
www.vishay.com
1

7페이지


구       성 총 8 페이지수
다운로드[ SiHF820S.PDF 데이터시트 ]

당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는

포괄적인 데이터시트를 제공합니다.


구매 문의
일반 IC 문의 : 샘플 및 소량 구매
-----------------------------------------------------------------------

IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한
광범위한 전력 반도체를 판매합니다.

전력 반도체 전문업체

상호 : 아이지 인터내셔날

사이트 방문 :     [ 홈페이지 ]     [ 블로그 1 ]     [ 블로그 2 ]



관련 데이터시트

부품번호상세설명 및 기능제조사
SiHF820

Power MOSFET ( Transistor )

Vishay Siliconix
Vishay Siliconix
SiHF820A

Power MOSFET ( Transistor )

Vishay Siliconix
Vishay Siliconix

DataSheet.kr       |      2020   |     연락처      |     링크모음      |      검색     |      사이트맵