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PDF 7SB3257 Data sheet ( Hoja de datos )

Número de pieza 7SB3257
Descripción Mux / Demux Bus Switch
Fabricantes ON Semiconductor　
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No Preview Available ! 7SB3257 Hoja de datos, Descripción, Manual

7SB3257
Mux / Demux Bus Switch
The 7SB3257 Mux / Demux Bus Switch is an advanced high−speed
line switch in ultra−small footprint.
Features
• High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
• 3 W Switch Connection Between 2 Ports
• Power Down Protection Provided on Inputs
• Ultra−Small Packages
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
B1 A
B0
S
Figure 1. Logic Diagram
B1 1
6S
GND 2
B0 3
5 VCC
4A
Figure 2. TSOP−6/SC−88
(Top View)
B1 1
GND 2
B0 3
6S
5 VCC
4A
Figure 3. ULLGA6/UDFN6
(Top View)
Function Table
Input S
L
H
Function
A = B0
A = B1
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 4
1
http://onsemi.com
6
1
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
MARKING
DIAGRAMS
6
AK MG
G
1
6
6
TSOP−6
DT SUFFIX
AG MG
1 CASE 318G
G
1
ULLGA6
M
1.0 x 1.0
CASE 613AD
G
1
ULLGA6
M
1.2 x 1.0
G
CASE 613AE
1
ULLGA6
1.45 x 1.0
CASE 613AF
M
G
1
UDFN6
1.0 x 1.0
XM
CASE 517BX
1
UDFN6
1.2 x 1.0
CASE 517AA
M
G
1
UDFN6
1.45 x 1.0
CASE 517AQ
XM
1
AK, AG, K, D, L = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
7SB3257/D

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7SB3257 pdf
7SB3257
PACKAGE DIMENSIONS
D
65 4
E1
ÉÉÉÉÉÉ1 2 3
NOTE 5
e
E
b
0.05
A1
A
TSOP−6
CASE 318G−02
ISSUE U
H
L2
GAUGE
PLANE
L
M
DETAIL Z
C
SEATING
PLANE
c
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90
3.00
3.10
E 2.50 2.75 3.00
E1 1.30
1.50
1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
L2 0.25 BSC
M 0°
− 10°
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5

5 Page





7SB3257 arduino
7SB3257
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE
ISSUE A
DA
B
PIN ONE
REFERENCE
0.10 C
ÉÉÉÉÉÉ
TOP VIEW
0.10 C
E
0.05 C
A
6X 0.05 C SIDE VIEW
A1
SEATING
PLANE
C
1
L1
e
3
5X L NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
MILLIMETERS
DIM MIN MAX
A −−− 0.40
A1 0.00 0.05
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.25 0.35
L1 0.35 0.45
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
5X
0.49
6X
0.26
1.24
64
BOTTOM VIEW
6X b
0.10 C A B
0.05 C NOTE 3
1
0.53
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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