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PDF ESD203-B1-02 Data sheet ( Hoja de datos )
| Número de pieza | ESD203-B1-02 | |
| Descripción | Transient Voltage Suppressor Diodes | |
| Fabricantes | Infineon | |
| Logotipo |  |
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TVS Diode
Transient Voltage Suppressor Diodes
ESD203-B1-02 Series
Bi-directional ESD / Transient / Surge Protection Diodes
ESD203-B1-02ELS
ESD203-B1-02EL
Data Sheet
Revision 1.3, 2013-12-19
Final
Power Management & Multimarket
1 page  
ESD203-B1-02 Series
Characteristics
Table 2-2 DC Characteristics at TA = 25 °C, unless otherwise specified1)
Parameter
Symbol
Values
Min. Typ. Max.
Reverse working voltage
Reverse current
Trigger voltage
Holding voltage
1) Device is electrically symmetrical
VRWM
IR
Vt1
Vh
-
-
13.7
13.7
-
1
-
16
13.2
50
-
-
Unit
V
nA
V
V
Note / Test Condition
VR = 12 V
IR = 10 mA
Table 2-3 AC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Min. Typ. Max.
Line capacitance
CL -
69
Unit Note / Test Condition
pF VR = 0 V, f = 1 MHz
Table 2-4 ESD and Surge Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit Note / Test Condition
Min. Typ. Max.
Clamping voltage1)
VCL -
17 -
V ITLP = 16 A
- 23 -
ITLP = 30 A
Clamping voltage2)
- 17 -
IPP = 1 A
- 20 23
IPP = 5 A
Dynamic resistance1)
RDYN
-
0.29 -
Ω
1) ANSI/ESD STM5.5.1 - Electrostatic Discharge Sensitive Testing using Transmission Line Pulse (TLP) Model. TLP
conditions: Z0 = 50 Ω, tp = 100 ns, tr , = 0.6 ns, ITLP and VTLP averaging window: t1 = 30 ns to t2 = 60 ns, extraction of
dynamic resistance using least squares fit of TLP characteristic between ITLP1 = 5 A and ITLP2 = 40 A. Please refer to
Application Note AN210[1]
2) IPP according to IEC61000-4-5 (tp = 8/20 μs)
Final Data Sheet
5 Revision 1.3, 2013-12-19
5 Page 
4 Package Information
ESD203-B1-02 Series
Package Information
4.1 TSSLP-2-4
Top view
0.31
+0.01
-0.02
Bottom view
0.32 ±0.05
2
Cathode
marking
0.05 MAX.
1
0.26±0.035 1)
1) Dimension applies to plated terminals
Figure 4-1 TSSLP-2-4: Package outline (dimension in mm)
TSSLP-2-3, -4-PO V01
0.32
0.27
Copper Solder mask
Stencil apertures
TSSLP-2-3, -4-FP V02
Figure 4-2
TSSLP-2-4: Footprint (dimension in mm)
4 0.35
g
Tape type
Punched Tape
Embossed Tape
Ex Ey
0.43 0.73
0.37 0.67
Cathode
marking
Ex
Deliveries can be both tape types (no selection possible).
Specification allows identical processing (pick & place) by users.
TSSLP-2-3, -4-TP V03
Figure 4-3 TSSLP-2-4: Tape and reel (dimension in mm)
Figure 4-4 TSSLP-2-4: Marking example
Final Data Sheet
11
Revision 1.3, 2013-12-19
11 Page | ||
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| PDF Descargar | [ Datasheet ESD203-B1-02.PDF ] | |
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