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상세설명 | 제조사 |
Package Outline
P, PG-LQFP-64-4, -5, -13
Package Outline
1.6 MAX.
1.4 ±0.05
0.1 ±0.05
0.15 -0.06
+0.05
+0.07
H 0.6 ±0.15 0.2 -0.03
0.5 7.5 C 0.08 C 64x
0.08 M A-B D C 64x
12 10
1)
0.2 A-B D 64x 0.2 A-B D H 4x
D A
64
B
10
1)
Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side
1
Foot Print
Soldering Type: Reflow Soldering
0.5
12
1.35
11.45
0.5
0.29
0.29
11.45
Package Information
1.35
Published by Infineon Tec hnologies AG
7° MAX.
P, PG-LQFP-64-4
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