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상세설명 | 제조사 |
Package outline
PDF: 2003 Feb 18
Philips Semiconductors
Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH w M (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.
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