TQHBT3 PDF 데이터시트 검색

Production Process InGaP HBT Foundry Service Features Metal 2 - 4um TQHBT3 MIM Metal 0 Isolation Implant Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um B C B C NiCr Base Collector Sub Collector Buffer & Substrate TQHBT3 Process Cross-Section General Description TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance. Thick metal interconnects and high qualit