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PDF MCH03 Data sheet ( Hoja de datos )
| Número de pieza | MCH03 | |
| Descripción | Multi-layer ceramic chip capacitors | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MCH03 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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Ceramic capacitors
www.DataSheet4U.com
MCH03
Multi-layer ceramic chip capacitors
MCH03 (0603 (0201) size, chip capacitor)
zFeatures
1) Ultra miniature (0.6mm×0.3mm×0.3mm), Ultra light weight (0.3mg)
2) Suitable for mobile devices
3) Lead-free plating terminal
4) No polarity
zQuick Reference
The design and specifications are subject to change without prior notice. Please check the most recent technical
specifications prior to placing orders or using the product. For more detail information regarding packaging style code,
please check product designation.
Thermal compensation
Part No.
MCH03
Size code
0603
Temperature characteristics
code
(ppm/°C)
A (AN)
0±250(CK)
0±120(CJ)
0±60(CH)
Operating temp. range
(°C)
−55 to +125
Rated voltage
(V)
25
Capacitance (pF)
0.5 to 2.7 (E12 Series) ∗
3.0 to 3.9 (E12 Series) ∗
4 to 5 (E12 Series) ∗
5.1 to 10 (E12 Series) ∗
11 to 100 (E12 Series)
Capacitance
tolerance
C(±0.25pF)
D(±0.5pF)
J(±5%)
Thickness
(mm)
0.3 ± 0.03
∗ : 0.5pF/0.75pF/2pF/3pF/4pF/5pF/6pF/7pF/8pF/9pF available
zHigh dielectric constant
Part No.
Size code
Temperature characteristics
code
MCH03
0603
±10%(B)
CN ±15%
(R) (X7R)
±15%(X5R)
+30%, −80%
(F)
FN +22%, −82%
(Y5V)
Operating temp. range
(°C)
−25 to +85
−55 to +125
−55 to +85
−25 to +85
−30 to +85
Rated voltage
(V)
25
16
25
16
6.3
16
16
Capacitance (pF)
100 to 2,200 (E6 Series)
4,700 (E3 Series)
100 to 2,200 (E6 Series)
4,700 (E3 Series)
10,000 (E6 Series)
10,000 (E1 Series)
10,000 (E1 Series)
Capacitance
tolerance
Thickness
(mm)
K (±10%)
0.3 ± 0.03
Z (+80%, −20%)
zExternal dimensions (Unit : mm)
0.6±0.03
0.1Min. 0.17Min.
0.3±0.03
Rev.A
1/12
1 page  
Ceramic capacitors
www.DataSheet4U.com
MCH03
No. Items
Performance
Test Method
(As per JIS C 5101-1, JIS C 5101-10)
6 Temperature
characteristic
A, AN
Capacitance C <− 2pF
0+/−250ppm/°C
Capacitance C=3pF
0+/−120ppm/°C
Capacitance C <− 4pF
0+/−60ppm/°C
(−55°C to +125°C)
As per 4.24 of JIS C 5101-1.
As per 4.7 of JIS C 5101-10
Temperature coefficient shall be calculated
at 20°C and 85°C.
C N X7R
+/−15%
As per 4.24 of JIS C 5101-1.
R (−55°C to +125°C) As per 4.7 of JIS C 5101-10
B
+/−10%
If required, measurements shall be made
(−25°C to +85°C) at a given temperature.
X5R
+/−15%
(−55°C to +85°C)
F N +30%, −80%
(−25°C to +85°C)
+22%, −82%
(−30°C to +85°C)
7 Solderability
More than 3/4 of each end
termination shall be covered with
new solder.
8 Resistance Appearance Without mechanical damage.
to solderin
heat
Change
rate from
initial value
A, AN
Within +/−2.5% or
+/−0.25pF whichever
is larger.
C N Within +/−7.5%
F N Within +/−20%
Dielectric
loss
tangent
Insulation
resistance
Within specified initial value.
Within specified initial value.
Withstanding No defects shall be allowed.
voltage
As per 4.15.2 of JIS C 5101-1.
As per 4.11 of JIS C 5101-10
The solder specified in JIS Z 3282 H63A
shall be used. Ans the flux containing 25%
rosin and ethanol solution shall be used.
The specimens shall be immersed into the
solder at 235+/−5°C for 2+/−0.5s
So that both end terminations are
completely under solder.
As per 4.14 of JIS C 5101-1.
As per 4.10 of JIS C 5101-10
The solder specified in JIS Z 3282. H63A
shall be used.
The specimens shall be immersed into the
solder at 260+/−5°C for 5+/−0.5s so that
both end terminations are completely
under the solder.
Pre-heating at 150+/−10°C for 1 to 2min
Initial measurements prior to test shall be
performed after the thermal
Pre-conditioning specified in Remarks (1).
Final measurements shall be made after the
specimens have been left at room
temperature as per Table3.
Charac-
teristic
A, AN
CN, FN
Table3
Time
24+/−2 h
48+/−4 h
9 End termination
adherence
Without peeling or sign of
peeling shall be allowed
on the end terminations.
As per 4.13 of JIS C 5101-1.
As per 4.8 ofJIS C 5101-10
A 2N weight for 10+/−1s shall be applied
to the soldered specimens as shown by the
arrow mark in the below sketch.
Applied pressure
Substrate
Capacitor
Rev.A
5/12
5 Page 
Ceramic capacitors
zPacking method
1) φ180mm Reel
2
1
Packing slip
A
B
C'
B'
A'
(interior box of R-26)
www.DataSheet4U.com
MCH03
EIAJ cole
(reel)
Label
[width of 9mm : 5reel]
C
(R-26)
< Packaging unit >
Symbol
Quantity of reel in
interior box
Quantity of reel in
box of R-26
K
5
20
< Appearance >
Carton
< Accumulation >
You must do accumulation by ten boxes
< Packaging slip >
1. Customer
2. Parts number
3. Quantity
4. Box quantity
5. Trade mark
Dimensions
A (A’)
B (B’)
C (C’)
R-26
195
255
190
Packaging
interior box of R-26
185
60
185
(Unit : mm)
zWeight / Piece
Size
Item
Thickness Characteristic
A, AN
0603 (0201) MCH03
0.3mm
CN
FN
(Note) The measured values in the table are for reference only.
Actual weight of these chips may very slightly lot by lot.
(Unit : mg)
Weight / Piece
0.3
0.3
0.3
Rev.A 11/12
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet MCH03.PDF ] | |
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