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PDF LP3933 Data sheet ( Hoja de datos )
| Número de pieza | LP3933 | |
| Descripción | Lighting Management System for Six White LEDs and Two RGB or FLASH LEDs | |
| Fabricantes | National Semiconductor | |
| Logotipo |  |
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March 2004
LP3933
Lighting Management System for Six White LEDs and
Two RGB or FLASH LEDs
General Description
The LP3933 is a complete lighting management system
designed for portable wireless applications. It contains a
boost DC/DC converter, 4 white-LED drivers to drive the
main LCD panel backlight, 2 white-LED drivers for the sub-
LCD panel and two sets of RGB/FLASH LED drivers.
Both backlight drivers have 8-bit constant current drivers that
are separately adjustable and matched to 0.5% (typ.). The
RGB LED drivers are PWM-driven with programmable color,
intensity and blinking patterns. In addition, they feature a
FLASH function to support picture taking with camera-
enabled cellular phones.
An efficient magnetic boost DC/DC converter provides the
required bias for LEDs, operating from a single Li-Ion bat-
tery. The DC/DC converter output voltage is user program-
mable from 4.1V to 5.3V for adapting to different LED types
and for efficiency optimization. All functions are software
controllable through a SPI interface and 19 internal registers.
Features
n High Efficiency Programmable 300 mA Magnetic Boost
DC-DC converter
n 2 separately controlled PWM RGB LED drivers with
programmable color, brightness, turn on/off slopes and
blinking patterns
n FLASH function with up to 6 outputs, each up to 120
mA
n 4 constant current LED drivers with programmable 8-bit
adjustment (0 … 25 mA/LED)
n 2 constant current LED drivers with programmable 8-bit
adjustment (0 … 25 mA/LED)
n Functions software controlled through SPI interface
n Additional LED on/off and dimming hardware control
n Programmable low current Standby mode
n Low voltage digital interface down to 1.8V
n Space efficient 32-pin thin CSP laminate package
Applications
n Cellular Phones
n PDAs
Typical Application
© 2004 National Semiconductor Corporation DS200805
20080505
www.national.com
1 page  
Electrical Characteristics (Notes 2, 11) (Continued)
Note 9: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125˚C), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX = TJ-MAX-OP − (θJA x PD-MAX).
Note 10: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 11: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 12: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics.
Note 13: VREF pin (Bandgap reference output) is for internal use only. A capacitor should always be placed between VREF and GND1.
Note 14: ESD susceptibility for pin 11 and 12 is 500V for the human body model and 150V for the machine model.
Block Diagram
20080503
5 www.national.com
5 Page 
Boost Converter Typical Performance Characteristics VIN = 3.6V, VOUT = 5.0V if not
otherwise stated. (Continued)
Battery Current vs Voltage
Battery Current vs Voltage
20080520
Boost Typical Waveforms at 100 mA Load
20080519
Boost Startup with No Load
Boost Line Regulation
20080514
20080516
Boost Load Regulation, 50 mA–100 mA
20080517
11
20080515
www.national.com
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet LP3933.PDF ] | |
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