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PDF MCE4WT-A2-0000-000JE4 Data sheet ( Hoja de datos )
| Número de pieza | MCE4WT-A2-0000-000JE4 | |
| Descripción | MC-E LED | |
| Fabricantes | Cree | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MCE4WT-A2-0000-000JE4 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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Cree® XLamp® MC-E LED
Product family data sheet
MC-E White
MC-E Color
Product Description
The XLamp MC-E LED is a family
of lighting-class, multi-chip LEDs
that provides high lumen output
in a small package. Compared to
discrete LEDs, XLamp MC-E LEDs
reduce the distance between LED
die, creating a small optical source
for excellent optical control and ef-
ficient color mixing. XLamp MC-E
LEDs can reduce LED system com-
plexity by reducing the number of
components required.
Cree XLamp LEDs bring high perfor-
mance and quality of light to a wide
range of lighting applications, in-
cluding color-changing lighting, por-
table and personal lighting, outdoor
lighting, indoor directional lighting,
and entertainment lighting.
FEATURES
• Available in white (2600 K –
10,000 K CCT), EasyWhite™,
Dynamic White, or color
(RGBW)
• ANSI-compatible neutral &
warm white chromaticity bins
• Individually addressable LEDs
http://www.DataSheet4U.com/
• MC-E Dynamic White LEDs
have two cool-white (6,500 K)
and two warm-white (2,700
K) LED die
• MC-E EasyWhite LEDs avail-
able in 2 and 4-step bins, up
to 85 CRI
• Maximum drive current: 700
mA per LED die
• Reflow solderable – JEDEC
J-STD-020
• Electrically neutral thermal
path
• RoHS and REACH-compliant
MC-E Dynamic White
Table of contents
Flux Characteristics..................... 2
Flux Characteristics, EasyWhite.... 3
Characteristics -
Complete Package.................. 4
Characteristics -
Per LED Die (White)................ 4
Characteristics -
Per LED Die (Color)................. 5
Relative Spectral Power Distribution
- White..................................... 5
Relative Spectral Power Distribution
- Color...................................... 5
Relative Flux Output vs Junction
Temperature.............................. 6
Electrical Characteristics.............. 7
Relative Intensity vs. Current....... 7
Typical Spatial Radiation Pattern... 8
Reflow Soldering Characteristics... 9
Notes.......................................10
Mechanical Dimensions..............11
Tape and Reel...........................12
Dry Packaging and Packaging......13
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without
notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1 page  
xlamp MC-e leds
RelatRiveelaSptievcetraSlpPeocwterraDliPstoriwbuetrioDni(sIFtr=ib35u0tmioA nper(IfLE=D)3-5W0himteA per LED) - Whit
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100
80
60
40
20
0
400 450 500 550 600 650 700 750
Wavelength (nm)
5000K - 10000K CCT
3700K - 5000K CCT
2600K - 3700K CCT
Relative Spectral Power Distribution (IF = 350http://www.DataSheet4U.com/ mA per LED) - Color
TheRfoellolwaintgivgreaphSreppreesecnttsrtayplicPal sopewctreal rouDtpuitsofttrhiebXLuamtipoMnC-E(CIoflo=r LE3D 5wi0th mAall four LpEDesronLsimEuDlta)ne-ouCsly.olor
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
100
80
60
40
20
0
400 450 500 550 600 650 700 750
Wavelength (nm)
RGBW (6000K)
RGBW (4000K)
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
5
5 Page 
.80
TYP.
A Initial Release
B Change height due to new lens
C Change recommended solder pad footprint
D Height change due to new lens (was 3.86)
- Change package height FROM 1.5 TO 1.45
E
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
10/16/07
10/23/2007
11/26/2007
12/26/2007
5/12/2008
RC
RC
RC
RC 6
5
NOTICE
CRRCEE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
xlamp MC-e ledsMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INDC.
4
34
Mechanical Dimensions
D 4.48±.20
1.45
All measurements are ±.1mm unless otherwise indicated.
.05±.05
D3 6 5 4 3
D4 NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
TopOF CREE INC. View
65
65
NO1T.I5C0E BSC
NALAP.IRTTCEHHITSHDPELPORTOAPNRDIETTHAERIYNFAONRDM5ATION
FORMATION OF CREE, INC. THIS PLOT
PPOE.R0ITRE0OSADPON,RNDRIEETWTPHAIRETROHIYNODFAUUONTCRD.1TEM0HDAETOWIORRNDITITSECNLOCOSNESDETNOT ANY
OF CREE, INC. THIS PLOT
ODUCED OR DISCLOSED TO ANY
HOUT THE WRITTEN CONSENT
4
C
HEATSINK
4.48±.20
1.454.48±.20
1.45 .05±.05
2.60
.05±.05
INK
HEATSINK
C
4
1.45
.05±.05
4.48±.20
3
3
5.40
.75
+.13
-.03
A
.75
+.13
-.03
B
.75
+.13
-.03
1
.80
TYP.
.80
TYP1.
9.0+2..02
3
74.50
234
Bottom View
2.60
A
REV
A
B
C
D
E
2
REVISIO
2 REV COMMENTS
.80A Initial Release REVISIONS
REV COMMENTS B
TYP. R3.18A Initial ReleaseC
Change height due to new lens
DAT
Change recommended solder pad foot1p0r/in16t
1 2 .235 4B Change heighDt due Htoeingehwt clehnasnge due to new lens (was 31.806/)23/
C
D
CHehiagnhgt echreacnogmEe mdueend----toACADednddeheladdeswonttLelgaEdleDebSenesrprsretpiaoe(fawecsrdrekaCeacsfnoogo3cnoem.ef8tigph6md)eurieenrigasntihtgditoneFnadRtsOoPcCrMhseB1mf.o5aoTttiOcp1112r1i//n.224t665//
- Change package height FROM 1.5 TO 1.45
E
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2
Color
D1: DR2eDd3
D2: DG1rDe4en
D3: Blue
D4: White
7090
CA
Side View
2.60
A 5.40
2.60
.25 9.0+..02
B 9.0+..02 1.16
http://www.DataSheet4U.com/
7.50
R53.6.108
7.50
1.00 TYDP2. D3
D1 D4
D2 D3
D1 D4
T8op 7View6 5
1.50 BSC
DynamiPcITCWH hite
D1: Cool White NEGATIVE (-) 1 8
D2: W7.a00rm White .10
5.40
5.40 .25
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
X° ± 1° 1.16
DRAWN BY
R.Chaloupecky
CHECK
Ban Loh
APPROVED
MATERIAL
FOR SHBEET METAL PARTS ONLY
.X ± .25
.XX ± .10
FINAL PROTECTIVE FINISH
DATE
10/16/07
DATE 5.60
DATE
TITLE
1.00 TYP.
SIZE
C
X° ± 2°
5.60
5.60
1.00 TYP.
3.85
2
SCALE 20:1
R3.18
3.85
8 7 6 5 2.00
D3: Cool White
D4: Warm WhiteNEGATIVE (-) 2
.25 R3.18
87
65
1.50 BSC
1.50 BSC
PITCH
2.84 7.70 10.02
NEGATIVE (-) 3
4600 Silicon Drive
Durham, N.C 27703
2.75
PITCH 7.00
.10
7090MC PARALLEL / INDEPENDENT
7.00 CONFIGURAT.I1O0N 1.30
NEGATIVE (-) 4
A
OUTLINE DRAWING,
7090MC PACKAGE
DRAWING NO.
A
2610-00005
REV.
1.50 BSC
PITCH
NEGATIVE (-) 1 8
E
D1
D5
1 POSITIVE (+) 1
7090MC PARARLELCELO/ MINDMEEPNENDDEEDNTPCB SOLDER PAD
2.00
SHEET 1 OF 1
70190MC PARALLEL
/ CI21NO..DNEFPSTIooGEllNUedDrReaEArnNNmTEcITGOeaAsNsT:kIVwE.1in(0-)d2ow7s
must
be
.05
D2
mm
bigger
2
CONFIGURATION than PCB Solder Pad.
D6
POSITIVE (+) 2
7
6
5
2.84 7.70
NEGATIVE
(-)110.082
D1 1
NEGATIVE (-) 3
6POSITIVE (+) 1
D3
3 POSITIVE (+) 3
0 TYP.
NEGATIVE (-) 1 8
D1 D5 16 POSITIVE (+) 1
D7
5
4
2.75
2.00
1.30
NEGATIVE
(-)
2 D5
7
D2 2
NEGATIVE (-) 4
5POSITIVE (+) 2
D4
4 POSITIVE (+) 4
2.00
NEGATIVE (-) 2 7
D2 D6 2 POSITIVE (+) 2
D8
A
1.50 BSC
PITCH
2.84 7.70 10.02
NEGATIVE (-) 3D6 6
D3 3 POSITIVE (+) 3
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
DRA
R.C
2.75
RE2C.8O4 MM7.7E0ND10E.D02 PCB SOLDERNEPGAATDIVE (-) 3 6
Re1c. omTolmeraenncedse: d.11P.03C0 B Solder Pad
2. Solder mask windows must be .05 mm bigger
NEGATIVE (-) 4D7 5
D3
D7 3 POSITIVE (+) 3
D4 4 POSITIVE (+) 4
THIRD ANGLE PROJECTION
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
CHE
Ba
APPR
X° ± 1°
MATE
75
C
th1a.n30PCB Solder Pad.
NEGATIVE (-) 4 5
D4 D8 4 POSITIVE (+) 4
FOR SHEET METAL PARTS ONLY
.X ± .25
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this doD8cument is subject to change without notice. Cree, UthNLeESCSDrIOMeTEHeNESRlIOoWNgISSoEASRaPEEnICNdIFIEXDLampDRR.aCAWrheNalBoYruepegciksyterDeA1X.dTX0°EX/1t6r/±a0±72d.°1e0 -
FINAL
ECOMMENmaDrEksDoPf CCreBeS, OIncL.DE6R PAD
oNolledDreaErDnmcPeasCs:kBw.1Sin0OdoLwDsEmRuPsAt bDe .05 mm bigger
han PCB Solder Pad.
5
MILLIMETERS & BEFORE FINISH. CHECK
4
UNLESSDIOMTEHNESRIOWNISSETAOSRLPEEERICNAIFNICEDE.XUNLE±S0SDR.3R.SCAPWhENaClBoIYFuIpEeDc: k3y
DABTaEn Loh
10/16/07
APPROVED
MILLIMETERS & BEFORE FIN.XISXH. ± C.1H3ECK
DATE
THIRD ANGLE PROTJOELCETRIAONNCE.XUNLE±S0S.3SPECIFIEDX: °
Ban Loh
± 1A°PPROVED
MATERIAL
DATE
.XX ± .1F3OR SHEET METAL PARTS ONLY
DATE
DATE
TITLE
11TITLE
O
7
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet MCE4WT-A2-0000-000JE4.PDF ] | |
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