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PDF ESD5381 Data sheet ( Hoja de datos )
| Número de pieza | ESD5381 | |
| Descripción | ESD Protection Diodes | |
| Fabricantes | ON Semiconductor | |
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ESD5381 Series
ESD Protection Diodes
Micro−Packaged Diodes for ESD Protection
The ESD5381 series are designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of their small size, they are suited for use
in cellular phones, MP3 players, digital cameras and many other
portable applications where board space comes at a premium.
Specification Features
• Low Capacitance
• Low Clamping Voltage
• Small Body Outline Dimensions: 0.60 mm x 0.30 mm
• Low Body Height: 0.3 mm
• Low Leakage
• Response Time is < 1 ns
• IEC61000−4−2 Level 4 ESD Protection
• IEC61000−4−4 Level 4 EFT Protection
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
8 kV
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
RqJA
TJ, Tstg
TL
300 mW
400 °C/W
−55 to +150 °C
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
www.onsemi.com
1
Cathode
2
Anode
X3DFN2
CASE 152AF
MARKING
DIAGRAM
PIN 1
XM
X = Specific Device Code
M = Date Code
(Specific marking on following page)
ORDERING INFORMATION
Device
Package
Shipping†
ESD5381MUT5G X3DFN2
(Pb−Free)
15000 /
Tape & Reel
ESD5382MUT5G X3DFN2
(Pb−Free)
15000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 5
1
Publication Order Number:
ESD5381/D
1 page  
ESD5381 Series
PACKAGE DIMENSIONS
X3DFN2, 0.62x0.32, 0.355P, (0201)
CASE 152AF
ISSUE A
PIN 1
INDICATOR
(OPTIONAL)
D AB
TOP VIEW
E
0.05 C
A
2X 0.05 C
A1
SIDE VIEW
C
SEATING
PLANE
e
2X b
12
2X L2
0.05 M C A B
BOTTOM VIEW
0.05 M C A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
DIM MIN MAX
A 0.25 0.33
A1 −−− 0.05
b 0.22 0.28
D 0.58 0.66
E 0.28 0.36
e 0.355 BSC
L2 0.17 0.23
RECOMMENDED
MOUNTING FOOTPRINT*
0.74
2X
0.30
1
2X 0.31
DIMENSIONS: MILLIMETERS
See Application Note AND8398/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com
5
ESD5381/D
5 Page | ||
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| PDF Descargar | [ Datasheet ESD5381.PDF ] | |
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