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Datasheet PSF Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | PSF | Metal Film Resistors www.vishay.com
PSF
Vishay Dale
Metal Film Resistors, High Precision, High Stability, Surface Mount
FEATURES
• Extremely low temperature coefficient of resistance
• Molded encapsulation • Wraparound compliant terminations eliminate
the risk of solder fillet cracking • Solderable terminatio |  Vishay | data |
| 2 | PSF2012 | Metal Film Resistors www.vishay.com
PSF
Vishay Dale
Metal Film Resistors, High Precision, High Stability, Surface Mount
FEATURES
• Extremely low temperature coefficient of resistance
• Molded encapsulation • Wraparound compliant terminations eliminate
the risk of solder fillet cracking • Solderable terminatio | Vishay | data |
| 3 | PSF21150 | IPAC-X ISDN PC ADAPTER CIRCUIT Data Sheet, DS1, Jan. 2003
IPAC-X
ISDN PC Adapter Circuit PSB/PSF 21150, V 1.4
Wired Communications
Never stop thinking.
ABM®, ACE®, AOP®, ARCOFI®, ASM®, ASP®, DigiTape®, DuSLIC®, EPIC®, ELIC®, FALC®, GEMINAX®, IDEC®, INCA®, IOM®, IPAT®-2, ISAC®, ITAC®, IWE®, IWORX®, MUSAC®, Mu |  Infineon Technologies | data |
| 4 | PSF21525-H | High-Level Serial Communications Controller Product Brochure for HSCX TE High-Level Serial Communications Controller for Terminals PSB/PSF 21525
The HSCX TE is an optimized terminal version of the HSCX (SAB 82525). The HSCX TE has been designed to implement high-speed communication links using HDLC protocols and to reduce the hardware and sof |  Infineon Technologies Corporation | controller |
| 5 | PSF21911 | ISDN Echocancellation Circuit for Terminal Applications IEC-Q TE ICs for Communications
ISDN Echocancellation Circuit for Terminal Applications IEC-Q TE PSB 21911 Version 5.2 PSF 21911 Version 5.2
Data Sheet 11.97
DS 1
PSB 21911 Revision History: Previous Releases: Page
Original Version: 11.97 None
Subjects (changes since last revision)
For questions on tech |  Siemens Semiconductor Group | data |
PSF Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | PSF | Metal Film Resistors www.vishay.com
PSF
Vishay Dale
Metal Film Resistors, High Precision, High Stability, Surface Mount
FEATURES
• Extremely low temperature coefficient of resistance
• Molded encapsulation • Wraparound compliant terminations eliminate
the risk of solder fillet cracking • Solderable terminatio Vishay data | | |
| 2 | PSF2012 | Metal Film Resistors www.vishay.com
PSF
Vishay Dale
Metal Film Resistors, High Precision, High Stability, Surface Mount
FEATURES
• Extremely low temperature coefficient of resistance
• Molded encapsulation • Wraparound compliant terminations eliminate
the risk of solder fillet cracking • Solderable terminatio Vishay data | | |
| 3 | PSF21150 | IPAC-X ISDN PC ADAPTER CIRCUIT Data Sheet, DS1, Jan. 2003
IPAC-X
ISDN PC Adapter Circuit PSB/PSF 21150, V 1.4
Wired Communications
Never stop thinking.
ABM®, ACE®, AOP®, ARCOFI®, ASM®, ASP®, DigiTape®, DuSLIC®, EPIC®, ELIC®, FALC®, GEMINAX®, IDEC®, INCA®, IOM®, IPAT®-2, ISAC®, ITAC®, IWE®, IWORX®, MUSAC®, Mu Infineon Technologies data | | |
| 4 | PSF21525-H | High-Level Serial Communications Controller Product Brochure for HSCX TE High-Level Serial Communications Controller for Terminals PSB/PSF 21525
The HSCX TE is an optimized terminal version of the HSCX (SAB 82525). The HSCX TE has been designed to implement high-speed communication links using HDLC protocols and to reduce the hardware and sof Infineon Technologies Corporation controller | | |
| 5 | PSF21911 | ISDN Echocancellation Circuit for Terminal Applications IEC-Q TE ICs for Communications
ISDN Echocancellation Circuit for Terminal Applications IEC-Q TE PSB 21911 Version 5.2 PSF 21911 Version 5.2
Data Sheet 11.97
DS 1
PSB 21911 Revision History: Previous Releases: Page
Original Version: 11.97 None
Subjects (changes since last revision)
For questions on tech Siemens Semiconductor Group data | | |
| 6 | PSF4527 | Metal Film Resistors www.vishay.com
PSF
Vishay Dale
Metal Film Resistors, High Precision, High Stability, Surface Mount
FEATURES
• Extremely low temperature coefficient of resistance
• Molded encapsulation • Wraparound compliant terminations eliminate
the risk of solder fillet cracking • Solderable terminatio Vishay data | |
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