QFP44 데이터시트 PDF ( Data sheet )

_ Adapters V1.2 QFP44 T_PLCC44 POD target layout Target CPU package: QFP44 Body size: 10 mm x 10 mm Pitch: 0.8 mm POD target layout: T_PLCC44 Can be used with: Philips H-8xC52 POD Atmel 89C51CC POD EH-C513 POD 68HC05C9 POD 68HC11D3E POD 68HC11D3S POD Note that adapter solutions stated in th

_ Adapters V1.1 QFP44 - TET Target CPU package: QFP44 Body size: 10 mm x 10 mm Pitch: 0.8 mm POD target layout: T_QFP64 Can be used with: ST72F561 POD Note that adapter solutions stated in the document can be used only with listed PODs. Disregarding this warning may result in hardware failure of

LSI Assembly QFP44 (Units : mm) QFP44 14.0 10.0 33 23 22 12 1 11 34 44 14.0 10.0 H=2.3Max. w w w .d e e h s a t a . u t4 m o c The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any fo

PCB-TQFP44 QFP44 , LQFP44 , TQFP44 SMD Adapter Board (0.8mm pitch) Description The PCB-TQFP44 adapter module is designed to convert integrated circuits (IC) in 44-pin QFP, LQFP, TQFP packages to a top mounted module. This adapter was designed for engineers, students and hobbyists who are looking f

LSI Assembly QFP-A64 (Units : mm) QFP-A64 16.4 14.0 48 49 33 32 16.4 14.0 64 1 16 17 H=2.85Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means wi

QFP-ep Exposed Pad Quad Flat Pack 7 x 7mm to 24 x 24mm body sizes 32 to 216 lead count Lead pitch range from 0.80mm to 0.40mm FEATURES Body Sizes: 7 x 7mm to 24 x 24mm Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) Lead Counts: 32L to 216L Lead Pitch: 0.40mm to 0.80mm Wide range of o

QFP-SD Stacked Die Quad Flat Pack Stacking of die enables more functionality and integration in a conventional QFP package FEATURES Combining devices into one package reduces PCB real estate and cost Increased sub-system performance by integrating multiple chips into a single package Die to d