SDIP30 데이터시트 PDF ( Data sheet )

Thermal Data SDIP 30 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W, cm°C 0.01 W, cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 m molding compound 3.8 mm 0.0063W, cm°C Charts enclosed : 1) Rth(j-a) vs p

SDI-001 SERIAL D1 TO RGB, YPBPR AND CVBS MODULE + + + + Small compact design for pcb mounting 10 bit component outputs Simultaneous CVBS output Re-clocked SD outputs available + + + + Auto 625, 525 operation Switchable RGB or YPbPr Full video bandwidth filtered outputs NTSC Setup selection This i

SDI-002 SERIAL D1 TO RGB MODULE + + + + Small compact design for pcb mounting 8 bit RGB output Separate mixed syncs RsGsBs (Combined sync) available. + + + Auto 625, 525 operation Fully filtered outputs Reclocked SD outputs available. This interface card accepts D1 serial digits and provides all

SDI-003 SERIAL D1 TO CVBS, YC MODULE + + + Small compact design for pcb mounting Fully filtered and buffered outputs Three CVBS outputs or CVBS + Y, C output + + Auto 625, 525 operation Reclocked outputs available This interface card accepts D1 serial digits and provides three analogue Composite