TSSOP48 데이터시트 PDF ( Data sheet )

DIMENSIONS REF. A A1 A2 b c D E8 E1 e K0 L ° 0.45 6.0 0.5 8° 0.75 0° 0.018 0.17 0.09 12.4 .1 6.2 0.236 0.0197 8° 0.030 0.05 0.9 0.27 0.20 12.6 0.0067 0.0035 0.488 0.318 0.244 mm MIN. TYP. MAX. MIN. 1.2 0.15 0.002 inch TYP. MAX. 0.047 0.006 0.035 0.011 0.0079 0.496 PACKAGE AND PACKING INFORMAT

DAISY CHAIN TOP VIEW (INTERNAL CONNECTIONS) 48 25 PIN 1 24 DAISY CHAIN NET LIST PINS PINS 11 ~ 12 13 ~ 14 15 ~ 16 17 ~ 18 19 ~ 20 PINS 21 ~ 22 23 ~ 24 25 ~ 26 27 ~ 28 29 ~ 30 PINS 31 ~ 32 33 ~ 34 35 ~ 36 37 ~ 38 39 ~ 40 PINS 41 ~ 42 43 ~ 44 45 ~ 46 47 ~ 48 1~2 3~4 5~6 7~8 9 ~ 10 NOTES: 1.

Philips Semiconductors PC board footprint Footprint information for reflow soldering of TSSOP48 package SOT362-1 Hx Gx P2 (0.125) (0.125) Hy Gy By Ay C D2 (4x) P1 Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS

TSSIO16E VAN peripheral circuit - 16 inputs-outputs 1. Features q q q q q q q q q q q q Management of 16 inputs-outputs (16-bit or two 8-bit configurable ports) VAN protocol V4.0 3 external wired address Safety mode in case of transmission loss Automatic adaptation to speed of bus from 8kTS, s to 2

Small Signal Product TSS0230LU Taiwan Semiconductor Surface Mount Schottky Barrier Diode FEATURES - Designed for mounting on small surface - Extremely thin, leadless package - Low capacitance - Low forward voltage drop - Packing code with suffix "G" means green compound (halogen-free) MECHANICAL

Small Signal Product Surface Mount Schottky Barrier FEATURES - Designed for mounting on small surface - Extremely thin, leadless package - Low capacitance - Low forward voltage drop - Packing code with suffix "G" means green compound (halogen-free) TSS0230U Taiwan Semiconductor MECHANICAL DATA - C